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this is information on a product in full production. march 2014 docid15845 rev 3 1/11 EMIF02-SPK01M6 2-line ipad?, emi filter and esd protection for speaker datasheet - production data figure 1. pin configuration (top view) and basic cell configuration features ? emi symmetrical (i/o) low-pass filter ? high efficiency in emi filtering ? very low pcb space consumption: 1.0 mm x 1.45 mm ? pitch 0.5 mm ? very thin package: 0.6 mm max ? high efficiency in esd suppression ? high reliability offered by monolithic integration ? high reduction of parasitic elements through integration and wafer level packaging ? lead-free package complies with following standards ? iec 61000-4-2 level 4, input pins ? 15 kv (air discharge) ? 8 kv (contact discharge) ? iec 61000-4-2 level 1, output pins ? 2 kv (air discharge) ? 2 kv (contact discharge) ? milstd883 class 3b application ? mobile telephones description the EMIF02-SPK01M6 is a 2-line, highly integrated device designed to suppress emi/rfi noise in all systems exposed to electromagnetic interference. this filter includes esd protection circuitry, which prevents damage to the application when subjected to esd surges up to 15 kv. tm: ipad is a trademark of stmicroelectronics micro qfn 6 leads 1.45 mm x 1.00 mm (bottom view) pin 1 6 2 5 4 spk r in spk r out spk l in spk l out gnd gnd 1 3 input output low-pass filter gnd gnd gnd www.st.com
characteristics EMIF02-SPK01M6 2/11 docid15845 rev 3 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute ratings (limiting values at t amb = 25 c unless otherwise specified) symbol parameter value unit v pp esd discharge iec 61000-4-2 air discharge on input pins air discharge contact discharge esd discharge iec 61000-4-2 contact discharge on output pins air discharge contact discharge milstd883 class 3b 15 8 2 2 8 kv t j junction temperature 125 c t op operating temperature range -30 to +85 c t stg storage temperature range -55 to +150 c symbol parameter v = breakdown voltage i = leakage current @ v v = stand-off voltage i = peak pulse current i = breakdown current br rm rm rm pp r v = clamping voltage cl i v i pp v cl v br v rm i r i rm i rm i r i pp v rm v br v cl table 2. electrical characterisitcs (t amb = 25 c) symbol test conditions min. typ. max. unit v br i r = 1 ma 6 8 v i rm v rm = 3 v per line 500 na r i/o tolerance 20% 10 c line v r = 0, f = 1 mhz, v osc = 30 mv, 30% 220 pf
docid15845 rev 3 3/11 EMIF02-SPK01M6 characteristics 11 figure 3. attenuation measurement s21 (db) 300.0k 1.0m 3.0m 10.0m 30.0m 100.0m 300.0m 1.0g 3.0g -35.00 -30.00 -25.00 -20.00 -15.00 -10.00 -5.00 0.00 f (hz) figure 4. esd response to iec 61000-4-2 +15 kv air discharge on spk r line figure 5. esd response to iec 61000-4-2 +15 kv air discharge on spk l line vi = 10 v/d vo = 10 v/d 100 ns/d spk r in spk r out vi = 10 v/d vo = 10 v/d 100 ns/d spk l in spk l out figure 6. esd response to iec 61000-4-2 - 15 kv air discharge on spk r line figure 7. esd response to iec 61000-4-2 - 15 kv air discharge on spk lline vi = 10 v/d vo = 10 v/d 100 ns/d spk r in spk r out vi = 10 v/d vo = 10 v/d 100 ns/d spk l in spk l out
ordering information scheme EMIF02-SPK01M6 4/11 docid15845 rev 3 2 ordering information scheme figure 8. ordering information scheme emif yy - xxx zz mx emi filter number of lines information package xxx = application zz = version mx = micro qfn x leads
docid15845 rev 3 5/11 EMIF02-SPK01M6 package information 11 3 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 3. micro qfn 1.45 x 1.00 6l dimensions ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.50 0.55 0.60 0.020 0.022 0.024 a1 0.00 0.02 0.05 0.000 0.001 0.002 b 0.18 0.25 0.30 0.007 0.010 0.012 d 1.45 0.057 e 1.00 0.039 e 0.50 0.020 k 0.20 0.008 l 0.30 0.35 0.40 0.012 0.014 0.016 e d a a1 e b k l n 1 1 2 2 figure 9. footprint in mm [inches] figure 10. marking 0.50 [0.020] 0.25 [0.010] 0.60 [0.023] 0.30 [0.012] 1.60 [0.063] dot : pi n 1 identification k = marking k
package information EMIF02-SPK01M6 6/11 docid15845 rev 3 figure 11. tape and reel specification note: product marking may be rotated by 90 for assembly plant differentiation. in no case should this product marking be used to orient the component for its placement on a pcb. only pin 1 mark is to be used for this purpose. dot identifying pin 1 location k k k 2.0 0.05 4.00 0.1 1.5 0.1 0.75 1.65 1.20 4.00 1.75 0.1 3.5 0.03 user direction of unreeling 8.0 0.3
docid15845 rev 3 7/11 EMIF02-SPK01M6 recommendation on pcb assembly 11 4 recommendation on pcb assembly 4.1 stencil opening design 1. general recommendation on stencil opening design a) stencil opening dimensions: l (length), w (width), t (thickness). figure 12. stencil opening dimensions b) general design rule stencil thickness (t) = 75 ~ 125 m 2. reference design a) stencil opening thickness: 100 m b) stencil opening for leads: opening to footprint ratio is 90%. figure 13. recommended stencil window position l t w aspect ratio w t ----- 1.5 = aspect area lw 2t l w + () --------------------------- - 0.66 = 250 m 650 m 620 m 236 m 15 m 15 m 7m 7m footprint stencil window footprint
recommendation on pcb assembly EMIF02-SPK01M6 8/11 docid15845 rev 3 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed 4. solder paste with fine particles: powder particle size is 20-45 m. 4.3 placement 1. manual positioning is not recommended. 2. it is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. standard tolerance of 0.05 mm is recommended. 4. 3.5 n placement force is recommended. too much placement force can lead to squeezed out solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placement accuracy, a bottom side optical control should be performed with a high resolution tool. 6. for assembly, a perfect supporting of the pcb (all the more on flexible pcb) is recommended during solder paste printing, pick and place and reflow soldering by using optimized tools. 4.4 pcb design preference 1. to control the solder paste amount, the closed via is recommended instead of open vias. 2. the position of tracks and open vias in the solder area should be well balanced. the symmetrical layout is recommended, in case any tilt phenomena caused by asymmetrical solder paste amount due to the solder flow away.
docid15845 rev 3 9/11 EMIF02-SPK01M6 recommendation on pcb assembly 11 4.5 reflow profile figure 14. st ecopack recommended solder ing reflow profile for pcb mounting note: minimize air convection currents in the reflow oven to avoid component movement. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
ordering information EMIF02-SPK01M6 10/11 docid15845 rev 3 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode EMIF02-SPK01M6 k (1) 1. the marking can be rotated by 90 to diferentiate assembly location micro qfn 2.2 mg 3000 tape and reel (7?) table 5. document revision history date revision changes 11-sep-2009 1 initial release 21-sep-2009 2 updated figure 2 . 14-mar-2014 3 minor text changes
docid15845 rev 3 11/11 EMIF02-SPK01M6 11 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com

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